About
Lecturer, Program Leader, Head of School (Engineering and IT)
Manage engineering programs and students affairs Lecture engineering subjects (Diploma and Degree)
Part Time Tutor
Part-Time Tutor
Senior Lecturer
School of Engineering Robotics and Mechatronics Engineering Discipline
Senior Engineer
FOL Assembly Semiconductor (Front of Line Processes) Processes (Mounting, Sawing, Die Attach, Oven Cure, Wire Bond, 3rd Optical, Gel Coat, Lid Attach, dispensing) Pre-Molded Package, Sensor IC, MEMs - Micro-Electro-Mechanical Systems IC, Automotive ICs (IC = Integrated Circuit) 2 years experience in the flip chip, solder bump products, substrates Leadframe, reflow oven, and fluks
Engineer
FOL Assembly Semiconductor (Front of Line Processes) Process - Die Attach
Engineer
Polymer Industry - Keypad (Mobile Communication) Processes - Injection Molding, Hot Stamping, Printing, Reflow Oven, Keypad Assembly
Education
Universiti Tunku Abdul Rahman
PhD In Engineering (Industrial Engineering, Operations Research, Manufacturing)
Open University Malaysia
Master of Science (Engineering) - Industrial Engineering, Operations Research, Manufacturing
Universiti Tun Hussein Onn
Bachelor in Engineering (Electrical Engineering) - Electrical (Mechatronic)